Flexible Hybrid Electronics (FHE) are high-performance, integrated devices. Curved and variable in form factor, they augment day-to-day life with diverse applications, enabling us to interact with our surroundings like no personal computing devices have ever before.

As new methods for creating them emerge, business and supply chain paradigms are increasingly challenged. That’s what Building Outside the Box is all about. Thought-leaders will highlight the latest technology breakthroughs and business strategies, and provide informative demonstrations of flexible hybrid and printed electronics products, equipment, and materials, as well as the unique electronics applications they enable.

FLEX 2019 is currently co-located with the MEMS & Sensors Technical Congress (MSTC). Come to FLEX 2019 and consider attending sessions at the MSTC event to further expand your knowledge.